● Intel LGA1151 / 6th~9th generation processor series
●Intel Q250
●2*SODIMM DDR4 memory, support up to 64GB
●6*Intel I210AT, 4 of them support POE
●4*RS232 DB9 serial ports, COM3 supports RS232/485, COM4 supports RS232/422/485
●8*USB3.0, 2*USB2.0, built-in 1*USB2.0
●Support DIO 16 in 16 out with isolation (optional)
●Support 1 PCIE x16
Model | G3760F-L6E1 V1.0(G250)
| |
Chassis | Material/structure | Aluminium alloy + sheet metal material Fan cooling |
Colour | Iron grey + sand grain grey | |
Size (LWH) | 229*208*99.7MM | |
Weight (bare net) | 4.6KG | |
Installation | Desktop/Embedded/DIN rail | |
Motherboard | CPU | Intel®LGA1151 /6~9 Generation Processors |
System Chip | Intel®Q250 | |
Memory | 2*SODIMM DDR4 memory slots, support up to 64GB | |
Front Panel Interface | Switch | 1*Boot Button with Indicator, 1*One-Key Restore, 1*ACLOSS (Power-On DIP Switch) |
LED | 1*Hard Drive Indicator | |
USB | 2*USB3.0, 2*USB2.0, built-in 1*USB2.0 | |
Phoenix Terminal | 1*4P(1*power indicator signal, 1*power switch signal) | |
SIM | 1*SIM standard card slot (signal default M.2 5G) | |
Rear Panel Interface | Display Interface | 1*VGA(1920*1080@60Hz), 1*HDMI1.4 |
Switch | 1*On button, 1*One Key Restore | |
COM | 4*RS232 DB9 serial port, of which COM3 supports RS232/485, COM4 supports RS232/422/485 | |
LAN | 6*Intel I210AT Gigabit ports, 4 of which support POE | |
USB | 6*USB3.0 | |
GPIO | 16 in 16 out GPIO with isolation (optional) | |
Audio | 1*Audio, Line out and MIC 2 in 1 | |
DIP Switches | 2 sets of 6-digit dip switches, COM3 RS232/485 switching through the COM3 dip switch + BIOS combination, COM4 RS232/485/422 need to be achieved through the COM-SW1 jump cap + COM4 dip switch + BIOS combination | |
Power connector | 1*4P P=5.08mm Phoenix terminal, support DC 9~36V wide voltage input. | |
Storage | SATA | 1*2.5-inch hard drive bay |
MSATA | 1*MSATA | |
M.2 | 1*M.2/SSD,support Key-M,2280,NVME PCIEx4 SSD | |
Expansion | PCIE | 1*PCIE3.0 x16(support half-height graphics card only) |
M.2 | 1*M.2/WiFi,support Key-E,2230,WiFi module | |
1*M.2/5G, support Key-B,3042/3052,5G module | ||
System Support | Microsoft | Windows 10 |
Linux | Linux | |
Power Supply Type Input | Power supply type | External Power Adapter |
Voltage Input | DC 9-36V wide voltage | |
Power Output | AC TO DC 90W or more (depending on specific equipment) | |
Environment | Operating Temperature | -10℃~50℃ |
Storage Temperature | -20℃~70℃ | |
Relative Humidity | 5%-95% relative humidity, non-condensing | |
Operating Vibration | 0.5g rms/5-500HZ/random/operating |
No. | Model | CPU | Memory | Motherboard | Chipset | IO Board | PCIE | GPIO | LAN | COM | USB3.0 | USB2.0 | power |
1 | G3760F-L6E1 V1.0(G250) | LGA1151 6~9th | 2*SODDR4 | G250 | Q250 | G370-L6/G370-PW/G250-E1 | X16 | 16in16out | 6*I210 | 4 | 8 | 3 | 9-36V |
2 | G3760F-L6E1 V1.0(G670) | LGA1700 12~14th | 2*SODDR4 | G670 | H770 | G370-L6/G370-PW/G250-E1 | x16 | 16in16out | 6*I210 | 4 | 8 | 3 | 9-36V |